Invention Grant
- Patent Title: Method for manufacturing modular microfluidic paper chips using inkjet printing
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Application No.: US14398455Application Date: 2013-05-02
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Publication No.: US10201811B2Publication Date: 2019-02-12
- Inventor: Kwan Woo Shin , Hyo Jin Ko , Oh-Sun Kwon , Jae Hak Choi , Byeong No Lee , Ju Mi Lee
- Applicant: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION SOGANG UNIVERSITY
- Applicant Address: KR Seoul
- Assignee: Industry-University Cooperation Foundation Sogang University
- Current Assignee: Industry-University Cooperation Foundation Sogang University
- Current Assignee Address: KR Seoul
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: WOPCT/KR2013/003815 20130502
- International Application: PCT/KR2013/003815 WO 20130502
- International Announcement: WO2013/165194 WO 20131107
- Main IPC: B01L3/00
- IPC: B01L3/00 ; B81C1/00 ; B81B7/00

Abstract:
The present invention relates to a method for manufacturing a module type microfluidic chip comprising: (a) printing electrode patterns on a substrate using a conductive ink and inkjet printing; (b) cutting the printed electrode patterns; and (c) assembling the cut electrode patterns to manufacture the module type microfluidic paper chip. Unlike the traditional method for manufacturing printed circuit substrate using a patterning agent or device, the method of the present invention only incorporates a simple printing process using an inkjet printer, and thus patterning can be simplified and various types of chips can be manufactured depending on the assembly type of electrode patterns. Accordingly, inexpensive, economical, and highly utilizable microfluidic chips can be provided using the method of the present invention.
Public/Granted literature
- US20150110689A1 METHOD FOR MANUFACTURING MODULAR MICROFLUIDIC PAPER CHIPS USING INKJET PRINTING Public/Granted day:2015-04-23
Information query
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