Invention Grant
- Patent Title: Apparatus and method for processing wafer
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Application No.: US15616914Application Date: 2017-06-07
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Publication No.: US10204807B2Publication Date: 2019-02-12
- Inventor: You-Hua Chou , Min-Hao Hong , Kuan-Chung Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687
Abstract:
An apparatus for processing a wafer includes a process chamber, a wafer support, a heat source, and a movable device. The wafer support is in the process chamber. The heat source is in the process chamber. The movable device contacts the heat source, in which the movable device is movable with respect to the wafer support.
Public/Granted literature
- US20180308724A1 APPARATUS AND METHOD FOR PROCESSING WAFER Public/Granted day:2018-10-25
Information query
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