Invention Grant
- Patent Title: Closed loop temperature controlled circuit to improve device stability
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Application No.: US14856473Application Date: 2015-09-16
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Publication No.: US10206247B2Publication Date: 2019-02-12
- Inventor: Fuchao Wang , Olivier Le Neel , Ravi Shankar
- Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTD , STMICROELECTRONICS, INC.
- Applicant Address: US TX Coppell SG Singapore
- Assignee: STMICROELECTRONICS, INC.,STMICROELECTRONICS ASIA PACIFIC PTE LTD
- Current Assignee: STMICROELECTRONICS, INC.,STMICROELECTRONICS ASIA PACIFIC PTE LTD
- Current Assignee Address: US TX Coppell SG Singapore
- Agency: Seed IP Law Group LLP
- Main IPC: H05B3/00
- IPC: H05B3/00 ; H05B1/02 ; H05B3/12 ; H05B3/34 ; H01L23/34 ; H05B3/02 ; H05B3/06

Abstract:
An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.
Public/Granted literature
- US20160014845A1 CLOSED LOOP TEMPERATURE CONTROLLED CIRCUIT TO IMPROVE DEVICE STABILITY Public/Granted day:2016-01-14
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