Invention Grant
- Patent Title: Method for manufacturing structure for flexible printed circuit boards
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Application No.: US14906850Application Date: 2014-07-24
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Publication No.: US10206290B2Publication Date: 2019-02-12
- Inventor: Ducksu Oh , Sung Soo Park , Minsoo Kang
- Applicant: LG Display Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: LG DISPLAY CO., LTD.
- Current Assignee: LG DISPLAY CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2013-0087524 20130724
- International Application: PCT/KR2014/006735 WO 20140724
- International Announcement: WO2015/012611 WO 20150129
- Main IPC: H05K3/20
- IPC: H05K3/20 ; H05K3/36 ; H01L51/52 ; H05K3/46 ; H01L51/00
Abstract:
A method for manufacturing a structure of a flexible printed circuit board that is installed on a substrate in a display device is provided.
Public/Granted literature
- US20160157360A1 METHOD FOR MANUFACTURING STRUCTURE FOR FLEXIBLE PRINTED CIRCUIT BOARDS Public/Granted day:2016-06-02
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