An apparatus includes a matched die mold including a male die mold and a female die mold wherein the male die mold includes a first contoured surface and the female die mold includes a second contoured surface. The apparatus further includes a frame which defines an opening wherein the frame is positioned between the male die mold and the female die mold such that the frame is adapted to position a film layer across the opening and the opening is positioned in alignment with at least one of the first contoured surface and the second contoured surface.