Invention Grant
- Patent Title: Process-sensitive metrology systems and methods
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Application No.: US15174111Application Date: 2016-06-06
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Publication No.: US10216096B2Publication Date: 2019-02-26
- Inventor: Myungjun Lee , Mark D. Smith , Sanjay Kapasi , Stilian Pandev , Dzmitry Sanko , Pradeep Subrahmanyan , Ady Levy
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G03B27/54
- IPC: G03B27/54 ; G03F7/20

Abstract:
A lithography system includes an illumination source and a set of projection optics. The illumination source directs a beam of illumination from an off-axis illumination pole to a pattern mask. The pattern mask includes a set of pattern elements to generate a set of diffracted beams including illumination from the illumination pole. At least two diffracted beams of the set of diffracted beams received by the set of projection optics are asymmetrically distributed in a pupil plane of the set of projection optics. The at least two diffracted beams of the set of diffracted beams are asymmetrically incident on the sample to form a set of fabricated elements corresponding to an image of the set of pattern elements. The set of fabricated elements on the sample includes one or more indicators of a location of the sample along an optical axis of the set of projection optics.
Public/Granted literature
- US20170045826A1 Process-Sensitive Metrology Systems and Methods Public/Granted day:2017-02-16
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