Invention Grant
- Patent Title: Electronic component
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Application No.: US15613491Application Date: 2017-06-05
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Publication No.: US10217565B2Publication Date: 2019-02-26
- Inventor: Takashi Sawada , Yasuo Fujii , Takayuki Kayatani
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-112715 20160606
- Main IPC: H01G4/00
- IPC: H01G4/00 ; H01G4/30 ; H01G4/12 ; H01G4/008 ; H01G4/232 ; H01G4/228 ; H01G4/06

Abstract:
An electronic component includes a multilayer body, first to fourth outer electrodes, a pair of first insulating coating portions, and a pair of second insulating coating portions. The pair of first insulating coating portions is in at least one of a state in which inner end portions are in contact with the third outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode. The pair of second insulating coating portions is in at least one of a state in which inner end portions are in contact with the fourth outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode.
Public/Granted literature
- US20170352479A1 ELECTRONIC COMPONENT Public/Granted day:2017-12-07
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