Electronic component
    1.
    发明授权

    公开(公告)号:US10269497B2

    公开(公告)日:2019-04-23

    申请号:US15611888

    申请日:2017-06-02

    Abstract: An electronic component includes a laminated body including dielectric layers and internal electrode layers, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The internal electrode layers include first and second internal electrode layers, the second internal electrode layers each include first and second extended electrode portions. A relationship of L1/L2>1.0 is satisfied when a length of a first contact portion with one second external electrode in contact with the first extended electrode portion in the length direction is L1, and a length of a second contact portion with the other second external electrode in contact with the second extended electrode portion in the length direction is L2.

    THIN FILM CAPACITOR AND ELECTRONIC APPARATUS

    公开(公告)号:US20190080849A1

    公开(公告)日:2019-03-14

    申请号:US16190696

    申请日:2018-11-14

    Abstract: A plurality of first and second capacitor parts and second capacitor parts are formed on opposed main surfaces of a foil shaped conductive substrate to sandwich the conductive substrate. The first and second capacitor parts are respectively coated with insulative protection layers. Terminal electrodes are respectively formed on main surfaces of the protection layers. The terminal electrodes and conductive parts of the first and second capacitor parts are respectively electrically connected via first via conductors and the terminal electrodes and the conductive substrate 1 are electrically connected to second via conductors.

    Electronic component
    3.
    发明授权

    公开(公告)号:US10217565B2

    公开(公告)日:2019-02-26

    申请号:US15613491

    申请日:2017-06-05

    Abstract: An electronic component includes a multilayer body, first to fourth outer electrodes, a pair of first insulating coating portions, and a pair of second insulating coating portions. The pair of first insulating coating portions is in at least one of a state in which inner end portions are in contact with the third outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode. The pair of second insulating coating portions is in at least one of a state in which inner end portions are in contact with the fourth outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode.

    Monolithic capacitor
    4.
    发明授权
    Monolithic capacitor 有权
    单片电容器

    公开(公告)号:US09502178B2

    公开(公告)日:2016-11-22

    申请号:US13914957

    申请日:2013-06-11

    CPC classification number: H01G4/01 H01G4/012 H01G4/302

    Abstract: A monolithic capacitor includes a laminated body including stacked dielectric layers and substantially in the shape of a rectangular parallelepiped, and including a first surface being a mounting surface, a second surface opposite to the first surface, opposing third and fourth surfaces orthogonal to the first and second surfaces, and opposing fifth and sixth surfaces orthogonal to the first to fourth surfaces; capacitor electrodes disposed in the laminated body and each including a capacitive portion and a lead portion extending therefrom to at least one surface of the laminated body, the capacitive portions facing each other with dielectric layers interposed therebetween; and first and second outer electrodes disposed on at least one surface of the laminated body and connected to the lead portions. A gap between the first surface and the capacitive portions is greater than a gap between the second surface and the capacitive portions.

    Abstract translation: 单片电容器包括层叠体,该层叠体包括堆积的电介质层,并且基本上呈长方体形状,并且包括第一表面,即第一表面,与第一表面相对的第二表面,与第一表面正交的相对的第三和第四表面, 第二表面和与第一至第四表面正交的相对的第五和第六表面; 电容电极设置在所述层叠体中,并且每个电容电极包括电容部分和从其延伸到所述层叠体的至少一个表面的引线部分,所述电容部分彼此面对,其间插入介电层; 以及设置在所述层叠体的至少一个表面上并连接到所述引线部分的第一和第二外部电极。 第一表面和电容部分之间的间隙大于第二表面和电容部分之间的间隙。

    Electronic component
    5.
    发明授权
    Electronic component 有权
    电子元器件

    公开(公告)号:US08618422B2

    公开(公告)日:2013-12-31

    申请号:US13873303

    申请日:2013-04-30

    Abstract: A mounting structure includes an electronic component mounted on a circuit board. Land electrodes are disposed on a board body and are connected to outer electrodes of the electronic component through solders, respectively. A distance from each of the land electrodes to a top of the corresponding solder is not larger than about 1.27 times a distance from each of the land electrodes to an exposed portion of a capacitor conductor exposed at an end surface of the electronic component, the capacitor conductor being positioned closest to the circuit board.

    Abstract translation: 安装结构包括安装在电路板上的电子部件。 接地电极设置在电路板主体上,并分别通过焊料与电子部件的外部电极连接。 从每个焊盘电极到对应焊料的顶部的距离不大于从每个焊盘电极到暴露在电子部件的端面处的电容器导体的暴露部分的距离的大约1.27倍,电容器 导体定位成最靠近电路板。

    Multilayer capacitor
    7.
    发明授权

    公开(公告)号:US10600567B2

    公开(公告)日:2020-03-24

    申请号:US16233268

    申请日:2018-12-27

    Inventor: Yasuo Fujii

    Abstract: A multilayer ceramic capacitor includes a capacitor body and first to fourth outer connectors. The capacitor body includes dielectric layers and conductor layers, first and second principal surfaces facing each other in a height direction, first and second side surfaces facing each other in a length direction, and third and fourth side surfaces facing each other in a width direction. The first to fourth outer connectors cover portions of the first to fourth side surfaces, respectively. In a case where L0, W0, and H0 are maximum external dimensions of the multilayer ceramic capacitor in the length direction, the width direction, and the height direction, respectively, L0, W0, and H0 satisfy a condition of about 2.67≤L0/H0 and a condition of about 1/1.72≤L0/W0≤about 1.72.

    Electronic component and substrate including electronic component

    公开(公告)号:US10438749B2

    公开(公告)日:2019-10-08

    申请号:US15876247

    申请日:2018-01-22

    Abstract: An electronic component includes a multilayer body including dielectric layers and inner electrodes alternately laminated together, first to third outer electrodes arranged in this order in one direction on a first main surface of the multilayer body, and fourth to sixth outer electrodes provided on a second main surface opposite to the first main surface such that at least a portion of the fourth outer electrode, at least a portion of the fifth outer electrode, and at least a portion of the sixth outer electrode respectively face the first outer electrode, the second outer electrode, and the third outer electrode. The first, third, and fifth outer electrodes are electrically connected to one another. The second, fourth, and sixth outer electrodes are electrically connected to one another and each have a polarity different from that of the first outer electrode.

    Multilayer ceramic electronic component

    公开(公告)号:US10395835B2

    公开(公告)日:2019-08-27

    申请号:US15611874

    申请日:2017-06-02

    Abstract: A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. As viewed from at least one direction in the laminating direction, an end of the first external electrode and pair of second external electrodes, which is located closest to a first principal surface, is located closer to the first principal surface than an end of the pair of insulating coating portions, which is located closest to the first principal surface.

    Multilayer capacitor
    10.
    发明授权

    公开(公告)号:US10186377B2

    公开(公告)日:2019-01-22

    申请号:US15014161

    申请日:2016-02-03

    Inventor: Yasuo Fujii

    Abstract: A multilayer ceramic capacitor includes a capacitor body and first to fourth outer connectors. The capacitor body includes dielectric layers and conductor layers, first and second principal surfaces facing each other in a height direction, first and second side surfaces facing each other in a length direction, and third and fourth side surfaces facing each other in a width direction. The first to fourth outer connectors cover portions of the first to fourth side surfaces, respectively. In a case where L0, W0, and H0 are maximum external dimensions of the multilayer ceramic capacitor in the length direction, the width direction, and the height direction, respectively, L0, W0, and H0 satisfy a condition of about 2.67≤L0/H0 and a condition of about 1/1.72≤L0/W0≤about 1.72.

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