Invention Grant
- Patent Title: Bulk MLCC capacitor module
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Application No.: US15264305Application Date: 2016-09-13
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Publication No.: US10224149B2Publication Date: 2019-03-05
- Inventor: Galen W. Miller , John E. McConnell , John Bultitude , Garry L. Renner
- Applicant: KEMET Electronics Corporation
- Applicant Address: US SC Simpsonville
- Assignee: KEMET Electronics Corporation
- Current Assignee: KEMET Electronics Corporation
- Current Assignee Address: US SC Simpsonville
- Agency: Patent Filing Specialist, Inc.
- Agent Joseph T. Guy
- Main IPC: H01G4/38
- IPC: H01G4/38 ; H01G2/06 ; H01G4/12 ; H01G4/224 ; H01G4/232 ; H01G4/30 ; H01G4/40 ; H01L23/48 ; H01L23/52 ; H05K1/18

Abstract:
Provided is a module comprising a carrier material, comprising a first conductive portion and a second conductive portion, and a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first longitudinal edge of a first electronic component is connected to the first conductive portion by a first interconnect; and a second longitudinal edge of the first electronic component is connected to the second conductive portion by a second interconnect.
Public/Granted literature
- US20170169956A1 Bulk MLCC Capacitor Module Public/Granted day:2017-06-15
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