Invention Grant
- Patent Title: Wireless power coil with multi-layer shield
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Application No.: US15254439Application Date: 2016-09-01
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Publication No.: US10229782B2Publication Date: 2019-03-12
- Inventor: Vladimir A. Muratov
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01F3/10
- IPC: H01F3/10 ; H04B5/00 ; H01F27/36 ; H01F38/14

Abstract:
A wireless power assembly including a multi-layer magnetic shield is described. The wireless power assembly includes a wireless power coil and the multi-layer magnetic shield arranged adjacent to the wireless power coil. The magnetic shield includes a first layer comprising a first material and a second layer comprising a second material, wherein the second material has a higher permeability than the first material.
Public/Granted literature
- US20170178800A1 WIRELESS POWER COIL WITH MULTI-LAYER SHIELD Public/Granted day:2017-06-22
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