- 专利标题: Electronic component mounting device
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申请号: US14908438申请日: 2013-07-31
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公开(公告)号: US10231370B2公开(公告)日: 2019-03-12
- 发明人: Tetsuo Hayashi , Kuniyasu Nakane , Chikashi Teshima
- 申请人: FUJI CORPORATION
- 申请人地址: JP Chiryu
- 专利权人: FUJI CORPORATION
- 当前专利权人: FUJI CORPORATION
- 当前专利权人地址: JP Chiryu
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 国际申请: PCT/JP2013/070679 WO 20130731
- 国际公布: WO2015/015578 WO 20150205
- 主分类号: H05K13/04
- IPC分类号: H05K13/04 ; H05K13/08 ; H05K9/00 ; H05K3/30
摘要:
An electronic component mounting device, including: a board conveyance device which conveys and positions a board on which an electronic component is mounted; a mounting device which positions and mounts the electronic component to a mounting position of the board; a loading device which picks up multiple engaged members (clips), and positions and loads the engaged members to a loading position of the board; and a placing device which picks up a cover component that covers the mounted electronic component and that is provided with an engaging portion at a predetermined position, and positions and places the cover component to a position such that the engaging portion corresponds to the engaged member.
公开/授权文献
- US20160174425A1 ELECTRONIC COMPONENT MOUNTING DEVICE AND MOUNTING METHOD 公开/授权日:2016-06-16
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