- 专利标题： Method for coating a substrate with a lacquer and device for planarising a lacquer layer
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申请号： US14861105申请日： 2015-09-22
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公开(公告)号： US10232405B2公开(公告)日： 2019-03-19
- 发明人: Katrin Fischer , Florian Palitschka , Johannes Platen , Kento Kaneko
- 申请人： SUSS MicroTec Lithography GmbH
- 申请人地址： DE Garching
- 专利权人： SUSS MICROTEC LITHOGRAPHY GMBH
- 当前专利权人： SUSS MICROTEC LITHOGRAPHY GMBH
- 当前专利权人地址： DE Garching
- 代理机构： Hayes Soloway PC
- 优先权： DE102014113928 20140925
- 主分类号： B05D3/02
- IPC分类号： B05D3/02 ; B05D3/04 ; B05D3/10 ; B05D5/00 ; B05D7/04 ; B05D7/26 ; G03F7/00
摘要：
A method for coating a substrate with a lacquer is disclosed. First, the lacquer is uniformly applied to the substrate. Then, the solvent proportion of the lacquer applied to the substrate is reduced, and the coated substrate is exposed to a solvent atmosphere. In some embodiments, the lacquer is heated. The invention also relates to a device for planarizing a lacquer layer.
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