- 专利标题： Ultrasonic bonding jig, ultrasonic bonding method, and bonding structure
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申请号： US15936568申请日： 2018-03-27
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公开(公告)号： US10232464B2公开(公告)日： 2019-03-19
- 发明人: Hiroshi Miyashiro , Yoichi Suruga , Shuhei Koyano
- 申请人： NIPPON MEKTRON, LTD.
- 申请人地址： JP Tokyo
- 专利权人： NIPPON MEKTRON, LTD.
- 当前专利权人： NIPPON MEKTRON, LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： Studebaker & Brackett PC
- 优先权： JP2017-156753 20170815
- 主分类号： B23K20/00
- IPC分类号： B23K20/00 ; B23K20/10 ; B29C65/00 ; B29C65/08
摘要：
An ultrasonic bonding jig includes: a plurality of protrusions; a planar portion among protrusions formed among base ends of the protrusions; and recessed portions recessed to a side opposite to a projection direction of the protrusions, the recessed portions being formed on both sides in a vibration direction of the protrusions.
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