Arrangement and method for mechanically and electrically contacting a glow wire of a thermal radiation source made of refractory metal for semiconductor and microsystem technology

    公开(公告)号:US12090568B2

    公开(公告)日:2024-09-17

    申请号:US18015203

    申请日:2021-07-30

    申请人: Infrasolid GmbH

    发明人: Marco Schossig

    摘要: The invention discloses an arrangement for mechanically and electrically contacting a glow wire of a thermal radiation source, comprising a glow wire made of refractory metal having at least one flat connection surface to be contacted, a contact surface on which the glow wire is contacted, and a contacting means which connects the glow wire to the contact surface. The invention also relates to a method for producing the contact according to the invention. The problem addressed by the invention, of providing a reliable and enduringly stable mechanical and electrical contact of glow wires made of refractory metals, is solved in that the flat connection surface has at least two perforations and/or at a circumferential edge of the connection surface of the glow wire at least two recesses are formed, wherein the contacting means is integrally connected to the contact surface at the location of the perforations and/or recesses and forms both an electrical and a mechanical connection to the glow wire at the location of the perforations and/or recesses by means of a flange-like design of the contacting means above the connection surface of the glow wire.

    Wire bonding apparatus
    9.
    发明授权

    公开(公告)号:US11961819B2

    公开(公告)日:2024-04-16

    申请号:US17435041

    申请日:2020-03-04

    申请人: SHINKAWA LTD.

    摘要: A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.