Invention Grant
- Patent Title: Fluidic die
-
Application No.: US15687694Application Date: 2017-08-28
-
Publication No.: US10232610B2Publication Date: 2019-03-19
- Inventor: Daryl E. Anderson , George H. Corrigan , Scott A. Linn
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Fabian VanCott
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/045 ; B41J2/155 ; B41J2/175

Abstract:
A fluidic die includes a number of sensors to measure properties of a number of property control elements associated with the printhead die, a pass gate to communicate a number of signals to an application specific integrated circuit (ASIC) via an analog bus using control logic associated with the pass gate, and a bi-directional configuration bus coupled to the fluidic die to transmit a number of control signals to property control elements located on the fluidic die.
Public/Granted literature
- US20170355188A1 FLUIDIC DIE Public/Granted day:2017-12-14
Information query
IPC分类: