- 专利标题: Printhead with bond pad surrounded by dam
-
申请号: US15883316申请日: 2018-01-30
-
公开(公告)号: US10232619B2公开(公告)日: 2019-03-19
- 发明人: Chien-Hua Chen , Michael W. Cumbie , Devin A. Mourey
- 申请人: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 申请人地址: US TX Spring
- 专利权人: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人地址: US TX Spring
- 代理机构: HP Inc. Patent Department
- 主分类号: B41J2/14
- IPC分类号: B41J2/14 ; B41J2/045 ; B41J2/16
摘要:
In an embodiment, a printhead includes a fluidic die molded into a moldable material. The die has a front surface exposed outside the moldable material to dispense fluid and an opposing back surface covered by the moldable material except at a channel in the moldable material through which fluid may pass directly to the back surface. The die has a first bond pad on the front surface surrounded by a first dam to prevent the moldable material from contacting the first bond pad.
公开/授权文献
- US20180154632A1 PRINTHEAD WITH BOND PAD SURROUNDED BY DAM 公开/授权日:2018-06-07
信息查询
IPC分类: