Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the same
-
Application No.: US15697564Application Date: 2017-09-07
-
Publication No.: US10236357B2Publication Date: 2019-03-19
- Inventor: Yasumasa Yamane , Ryo Tokumaru , Hiromi Sawai
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2016-179466 20160914
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L21/443 ; H01L29/24 ; H01L29/423 ; H01L29/66 ; H01L29/786 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L21/66 ; H01L23/544 ; H01L27/105 ; H01L27/12

Abstract:
A semiconductor device having stable electrical characteristics is provided. A semiconductor device that can be miniaturized or highly integrated is provided. One embodiment of the present invention includes a transistor including an oxide, a first barrier layer over the transistor, and a second barrier layer in contact with the first barrier layer. The oxide is in contact with an insulator including an excess-oxygen region. The insulator is in contact with the first barrier layer. The first barrier layer has a thickness greater than or equal to 0.5 nm and less than or equal to 1.5 nm. The second barrier layer is thicker than the first barrier layer.
Public/Granted literature
- US20180076296A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2018-03-15
Information query
IPC分类: