Invention Grant
- Patent Title: Variable resistance memory device and method of manufacturing the same
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Application No.: US15432346Application Date: 2017-02-14
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Publication No.: US10236444B2Publication Date: 2019-03-19
- Inventor: Hideki Horii , Seong-Geon Park , Dong-Ho Ahn , Jung-Moo Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2016-0102316 20160811
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
A variable resistance memory device includes first conductive lines positioned above a substrate. Each of the first conductive lines extends in a first direction and a second direction. Second conductive lines extend in the first direction and the second direction. The second conductive lines are positioned above the first conductive lines. A memory is positioned between the first and second conductive lines. The memory unit overlaps the first and second conductive lines in a third direction. The memory unit includes a first electrode, a variable resistance pattern positioned on the first electrode, and a second electrode positioned on the variable resistance pattern. A selection pattern is positioned on each memory unit. A third electrode is positioned above the selection pattern. The third electrode is in direct contact with a lower surface of each of the second conductive lines.
Public/Granted literature
- US20180047899A1 VARIABLE RESISTANCE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-02-15
Information query
IPC分类: