Invention Grant
- Patent Title: Multiple via structure for high performance standard cells
-
Application No.: US15393180Application Date: 2016-12-28
-
Publication No.: US10236886B2Publication Date: 2019-03-19
- Inventor: Satyanarayana Sahu , Xiangdong Chen , Venugopal Boynapalli , Hyeokjin Lim , Mickael Malabry , Mukul Gupta
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox, LLP and Qualcor
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H03K19/0948 ; H01L27/118 ; H01L23/522 ; H01L27/02 ; H01L27/092

Abstract:
A MOS device of an IC includes pMOS and nMOS transistors. The MOS device further includes a first Mx layer interconnect extending in a first direction and coupling the pMOS and nMOS transistor drains together, and a second Mx layer interconnect extending in the first direction and coupling the pMOS and nMOS transistor drains together. The first and second Mx layer interconnects are parallel. The MOS device further includes a first Mx+1 layer interconnect extending in a second direction orthogonal to the first direction. The first Mx+1 layer interconnect is coupled to the first Mx layer interconnect and the second Mx layer interconnect. The MOS device further includes a second Mx+1 layer interconnect extending in the second direction. The second Mx+1 layer interconnect is coupled to the first Mx layer interconnect and the second Mx layer interconnect. The second Mx+1 layer interconnect is parallel to the first Mx+1 layer interconnect.
Public/Granted literature
- US20180183439A1 MULTIPLE VIA STRUCTURE FOR HIGH PERFORMANCE STANDARD CELLS Public/Granted day:2018-06-28
Information query
IPC分类: