Invention Grant
- Patent Title: Loudspeaker module
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Application No.: US15758421Application Date: 2016-05-06
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Publication No.: US10237659B2Publication Date: 2019-03-19
- Inventor: Yu Wang , Qianqian Song , Jianbin Yang , Zhi Li
- Applicant: Goertek Inc.
- Applicant Address: CN Shandong
- Assignee: Goertek Inc.
- Current Assignee: Goertek Inc.
- Current Assignee Address: CN Shandong
- Agency: Alston & Bird LLP
- Priority: CN201511030198 20151231
- International Application: PCT/CN2016/081246 WO 20160506
- International Announcement: WO2017/113558 WO 20170706
- Main IPC: H04R1/04
- IPC: H04R1/04 ; H04R9/02

Abstract:
A loudspeaker module, relating to the technical field of electroacoustic products. The loudspeaker module comprises a housing. A loudspeaker unit is accommodated in the housing. An electrical connection member which is a metal sheet is fixed on the housing. An inner bonding pad is disposed at one end of the electrical connection member, and an outer bonding pad is disposed at the other end of the electrical connection member. The inner bonding pad is located in the housing and is electrically connected to the loudspeaker unit. The outer bonding pad is exposed outside the housing and is electrically connected to a terminal circuit. The loudspeaker module of the present invention solves the technical problems in the prior art such as poor tone quality, low reliability, and a complicated assembling process of a loudspeaker module. The loudspeaker module of the present invention has good tone quality, high reliability, a long service life, a simple assembling process, and high production efficiency, and occupies a small space of a terminal, thereby facilitating the development of the terminal towards smaller size.
Public/Granted literature
- US20180249254A1 LOUDSPEAKER MODULE Public/Granted day:2018-08-30
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