An electronic device including a frame member suitable for use with an audio driver is disclosed. The frame member may include a recessed region that receives the audio driver. The frame member may further include a flange member surrounding the recessed region. The frame member may be formed from a material having a relatively high coefficient of thermal conductivity. Accordingly, the frame member can dissipate thermal energy (heat) generated from the audio driver. In addition, the frame member may be seated in an enclosure of an electronic device in a manner that allows the frame member to pass the thermal energy to the enclosure. Also, the frame member may include a ferromagnetic material, which may cause the frame member to direct magnetic flux from a magnet of the audio driver in a desired manner.