Invention Grant
- Patent Title: Speaker module with improved heat dissipation
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Application No.: US15762588Application Date: 2015-12-08
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Publication No.: US10237662B2Publication Date: 2019-03-19
- Inventor: Qingyi Zhang , Gang Chen , Shuangshuang Fan
- Applicant: Goertek Inc.
- Applicant Address: CN Shandong
- Assignee: Goertek Inc.
- Current Assignee: Goertek Inc.
- Current Assignee Address: CN Shandong
- Agency: Alston & Bird LLP
- Priority: CN201510642406 20150930
- International Application: PCT/CM2015/096721 WO 20151208
- International Announcement: WO2017/054318 WO 20170406
- Main IPC: H04R9/06
- IPC: H04R9/06 ; H04R1/02 ; H04R9/02

Abstract:
A speaker module comprising: a housing, the housing comprising an upper housing and a lower housing, the housing defining an inner cavity structure, at least one of the upper housing and the lower housing being provided with a group of micropores arranged in an array; and a speaker unit, comprising a magnetic circuit assembly and a vibrating assembly, the vibrating assembly dividing the inner cavity structure into a front cavity and a rear cavity, the magnetic circuit assembly being provided with a magnetic gap having a predetermined pattern, the magnetic circuit assembly being disposed close to the lower housing. A technical problem to be solved by the present invention is the heat dissipation of the speaker module.
Public/Granted literature
- US20180262841A1 SPEAKER MODULE Public/Granted day:2018-09-13
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