Acoustic module and electronic product

    公开(公告)号:US11425504B2

    公开(公告)日:2022-08-23

    申请号:US17289811

    申请日:2018-12-20

    Applicant: Goertek Inc.

    Abstract: Disclosed are an acoustic module and an electronic product. The acoustic module comprises: a module housing, comprising an upper housing and a lower housing, wherein the upper housing of the module has a side wall and a top wall, the side wall has a through hole thereon, a distance between an upper edge of the through hole and the top wall is greater than or equal to one half of an overall height of the side wall, and the upper housing is capable of being fastened onto the lower housing; a fixing member; and a microphone; wherein the fixing member is fastened and fixed in the upper housing, the fixing member is configured to fix the microphone on an inner surface of the top wall, and the fixing member has a sound channel formed therein through which the microphone and the through hole are connected and are in communication.

    Speaker and rear cover therefor
    2.
    发明授权

    公开(公告)号:US10362376B2

    公开(公告)日:2019-07-23

    申请号:US15781081

    申请日:2016-05-09

    Applicant: Goertek Inc.

    Abstract: The present invention discloses a speaker and a rear cover therefor. The rear cover comprises a rear cover body whose one side is provided with a first connection portion; and a connection assembly provided with a first surface and a second surface which are connected with each other. A contact is formed by extending and bending the first surface, and is provided with a conductor. A connection hole is further formed in the first surface. A limiting device and a second connection portion are arranged on the second surface; and the cross section of the limiting device is C-shaped. The connection assembly is connected to the first connection portion of the rear cover body through the second connection portion. The contact is configured to conduct the speaker with the outside. The connection hole is configured to fix the speaker or conduct the speaker with other components.

    Sound generation device and preparation method of metal plastic part

    公开(公告)号:US10667060B2

    公开(公告)日:2020-05-26

    申请号:US16097423

    申请日:2016-12-28

    Applicant: GOERTEK INC.

    Abstract: The present invention provides a sound generation device and a preparation method of a metal plastic part. The sound generation device comprises a metal plastic part. The metal plastic part comprises a plastic part and a metal insert that is combined with the plastic part. An oxidation film that is obtained through metal nanocrystallization and a nanopore that is formed in a surface of the oxidation film and has a pore diameter of 20-1,000 nm are arranged on a surface of the metal insert. The nanopore is filled with a resin composition from which the plastic part is made. As the nanopore is filled with the resin composition from which the plastic part is made, the metal insert and the plastic part are in close fit with each other, which greatly enhances the gluing capability of the metal insert and prevents the metal insert and the plastic part which are formed through injection molding from being separated. A length of a portion embedded into the plastic part of the metal insert is greatly reduced, such that transfer of ultrasonic energy is smooth. The metal plastic part is effectively prevented from ultrasonic unmelting. Thus, the waterproofness and the sealing property of the metal plastic part are improved. Accordingly, the performance of the sound generation device is improved.

    Speaker module with improved heat dissipation

    公开(公告)号:US10237662B2

    公开(公告)日:2019-03-19

    申请号:US15762588

    申请日:2015-12-08

    Applicant: Goertek Inc.

    Abstract: A speaker module comprising: a housing, the housing comprising an upper housing and a lower housing, the housing defining an inner cavity structure, at least one of the upper housing and the lower housing being provided with a group of micropores arranged in an array; and a speaker unit, comprising a magnetic circuit assembly and a vibrating assembly, the vibrating assembly dividing the inner cavity structure into a front cavity and a rear cavity, the magnetic circuit assembly being provided with a magnetic gap having a predetermined pattern, the magnetic circuit assembly being disposed close to the lower housing. A technical problem to be solved by the present invention is the heat dissipation of the speaker module.

    SPEAKER MODULE
    5.
    发明申请
    SPEAKER MODULE 审中-公开

    公开(公告)号:US20180262841A1

    公开(公告)日:2018-09-13

    申请号:US15762588

    申请日:2015-12-08

    Applicant: Goertek Inc.

    CPC classification number: H04R9/06 H04R1/025 H04R9/025

    Abstract: A speaker module comprising: a housing, the housing comprising an upper housing and a lower housing, the housing defining an inner cavity structure, at least one of the upper housing and the lower housing being provided with a group of micropores arranged in an array; and a speaker unit, comprising a magnetic circuit assembly and a vibrating assembly, the vibrating assembly dividing the inner cavity structure into a front cavity and a rear cavity, the magnetic circuit assembly being provided with a magnetic gap having a predetermined pattern, the magnetic circuit assembly being disposed close to the lower housing. A technical problem to be solved by the present invention is the heat dissipation of the speaker module.

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