Invention Grant
- Patent Title: Poly(imide-amide) copolymer, a method for preparing a poly(imide-amide) copolymer, and an article including a poly(imide-amide) copolymer
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Application No.: US15346876Application Date: 2016-11-09
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Publication No.: US10240002B2Publication Date: 2019-03-26
- Inventor: Hongkyoon Choi , Chanjae Ahn , Hyunjeong Jeon , Sang Soo Jee , Sungwon Choi , Sung Woo Hong , Byunghee Sohn
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , Samsung SDI Co., Ltd.
- Applicant Address: KR Gyeonggi-Do KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do KR Gyeonggi-Do
- Agency: Cantor Colburn LLP
- Priority: KR10-2015-0156846 20151109
- Main IPC: C08G73/14
- IPC: C08G73/14 ; B32B27/00 ; C09D179/08 ; C09J179/08 ; C08G73/10

Abstract:
A poly(imide-amide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2; and any one of a structural unit represented by Chemical Formula 3, an amic acid precursor of the structural unit represented by Chemical Formula 3, and a combination thereof; wherein a cured material of the poly(imide-amide) copolymer may have a tensile modulus of greater than or equal to about 5.5 GPa, and a yellowness index of less than or equal to about 5: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.
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