Methods and systems to improve a multilayer ceramic capacitor using additive manufacturing are disclosed. Conductive layer ends and dielectric layer edges of a multilayer ceramic capacitor may be modified to comprise a round shape, which may increase voltage limits by reducing electric field intensity that results from sharp corners. Further, the capacitor may comprise wave-like structures to increase surface area of a conductive layer and/or dielectric layer. The round shape of the conductive layer end may in-part reduce the need for a wide protective gap due to its dome-shape permitting the dielectric layer to be wider on top and bottom, and thinner at the center, e.g. concave, which provides strength support to the layers. The 3D Printing process permits the distance between the conductive layer end of the conductive layer to be much closer to the dielectric layer edge of the dielectric layer, such as below the standard 500 microns.