Invention Grant
- Patent Title: Substrate support with heater
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Application No.: US13205020Application Date: 2011-08-08
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Publication No.: US10242890B2Publication Date: 2019-03-26
- Inventor: Leon Volfovski , Mayur G. Kulkarni
- Applicant: Leon Volfovski , Mayur G. Kulkarni
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: H05B3/06
- IPC: H05B3/06 ; H01L21/67 ; H01L21/687 ; H05B3/14 ; H05B3/26

Abstract:
Embodiments of substrate supports with a heater are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first surface of the first member; a heater coupled to the first member and having one or more heating zones to provide heat to the first member; a second member disposed beneath the first member; a tubular body disposed between the first and second members, wherein the tubular body forms a gap between the first and second members; and a plurality of substrate support pins disposed a first distance above the first surface of the first member, the plurality of substrate support pins to support a backside surface of a substrate when present on the substrate support.
Public/Granted literature
- US20130037532A1 SUBSTRATE SUPPORT WITH HEATER Public/Granted day:2013-02-14
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