Invention Grant
- Patent Title: Multi-stage beam contacts
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Application No.: US13958029Application Date: 2013-08-02
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Publication No.: US10243284B2Publication Date: 2019-03-26
- Inventor: Philip T. Stokoe
- Applicant: Amphenol Corporation
- Applicant Address: US CT Wallingford
- Assignee: Amphenol Corporation
- Current Assignee: Amphenol Corporation
- Current Assignee Address: US CT Wallingford
- Agency: Blank Rome LLP
- Main IPC: H01R12/51
- IPC: H01R12/51 ; H01R13/193 ; H01R13/6473 ; H01R13/28

Abstract:
An electrical connector has a first wafer having a first housing with a first plurality of contact beams extending from the first housing in a first plane. A second wafer has a second housing with a second plurality of contact beams extending from said second housing in a second plane substantially parallel to the first plane. A dividing panel member extends from the insulative housing between the first plurality of contact beams and the second plurality of contact beams. Each of the contact beams extending from the wafer pair is configured to mate with a corresponding backplane contact in a backplane connector. The contact beams extending from the wafer pair and the backplane contacts are configured such that each pair of corresponding contacts includes a first contact point and a second contact point. When the wafer pair is fully received by the backplane connector, contact between the contact beam and the backplane contact is maintained at both the first and second contact points. Each of the contact beams includes a pivot member configured such that the electrical connector has a low initial insertion force, but a high normal force when fully mated with the backplane connector.
Public/Granted literature
- US20130316594A1 MULTI-STAGE BEAM CONTACTS Public/Granted day:2013-11-28
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