Invention Grant
- Patent Title: Heat conductive sheet and electronic apparatus using same
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Application No.: US15563649Application Date: 2016-06-23
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Publication No.: US10244658B2Publication Date: 2019-03-26
- Inventor: Koji Matsuno , Kazuhiko Kubo
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2015-128250 20150626
- International Application: PCT/JP2016/003025 WO 20160623
- International Announcement: WO2016/208192 WO 20161229
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; H05K7/20 ; H01L23/36
Abstract:
A heat conductive sheet includes a heat dissipating sheet, a first heat insulating layer provided above the heat dissipating sheet, a first sheet provided above the first heat insulating layer, and a second sheet provided below the heat dissipating sheet. The first sheet includes a first protruding portion protruding from the heat dissipating sheet viewing from above. The second sheet includes a second protruding portion protruding from the heat dissipating sheet viewing from above. A thermal conductivity of the first heat insulating layer is lower than any of a thermal conductivity of the first sheet, a thermal conductivity of the second sheet, and a thermal conductivity of the heat dissipating sheet. The first protruding portion overlaps and the second protruding portion viewing from above.
Public/Granted literature
- US20180098461A1 HEAT CONDUCTIVE SHEET AND ELECTRONIC APPARATUS USING SAME Public/Granted day:2018-04-05
Information query
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