公开(公告)号：US10091868B2

公开(公告)日：2018-10-02

申请号：US15325526

申请日：2015-09-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masafumi Nakayama ,  Koji Matsuno

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  F28F21/06 ,  F28F3/12 ,  F28F13/18

Abstract: A heat-dissipating sheet includes a thermally-conductive resin sheet, an adhesive layer on an upper surface of the thermally-conductive resin sheet, and a thermally-conductive film on an upper surface of the adhesive layer. The thermally-conductive film has a higher thermal conductivity than the thermally-conductive resin sheet. The thermally-conductive resin sheet has a thin portion that is locally thin to form a recess in a lower surface of the thermally-conductive resin sheet. The recess may be an aperture passing through the thermally-conductive resin sheet. The adhesive layer is exposed from the aperture.

公开(公告)号：US10244658B2

公开(公告)日：2019-03-26

申请号：US15563649

申请日：2016-06-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Koji Matsuno ,  Kazuhiko Kubo

IPC: G02F1/1333 ,  H05K7/20 ,  H01L23/36

Abstract: A heat conductive sheet includes a heat dissipating sheet, a first heat insulating layer provided above the heat dissipating sheet, a first sheet provided above the first heat insulating layer, and a second sheet provided below the heat dissipating sheet. The first sheet includes a first protruding portion protruding from the heat dissipating sheet viewing from above. The second sheet includes a second protruding portion protruding from the heat dissipating sheet viewing from above. A thermal conductivity of the first heat insulating layer is lower than any of a thermal conductivity of the first sheet, a thermal conductivity of the second sheet, and a thermal conductivity of the heat dissipating sheet. The first protruding portion overlaps and the second protruding portion viewing from above.