Invention Grant
- Patent Title: Low modulus shot sleeve for high temperature die casting
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Application No.: US15248235Application Date: 2016-08-26
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Publication No.: US10245637B2Publication Date: 2019-04-02
- Inventor: John Joseph Marcin , Dilip M. Shah , Carl R. Verner , Albert Rabinovich , Weiduo Yu , Thomas N. Slavens
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee Address: US CT Farmington
- Agency: Cantor Colburn LLP
- Main IPC: B22D17/20
- IPC: B22D17/20
Abstract:
Shot sleeves for high temperature die casting include a nickel-based alloy having a low modulus single crystal with axi-symmetric orientation.
Public/Granted literature
- US20180056380A1 LOW MODULUS SHOT SLEEVE FOR HIGH TEMPERATURE DIE CASTING Public/Granted day:2018-03-01
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