Invention Grant
- Patent Title: Housings for electronic devices
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Application No.: US15178499Application Date: 2016-06-09
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Publication No.: US10245770B2Publication Date: 2019-04-02
- Inventor: Douglas Weber , Stephen P. Zadesky , Stephen Brian Lynch
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: B29C45/16
- IPC: B29C45/16 ; B29C37/00 ; B29C45/14 ; B23K26/382 ; C23F1/00 ; C23F1/16 ; B29K705/00 ; B29L31/34 ; B29K55/02 ; B29K69/00

Abstract:
Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.
Public/Granted literature
- US20160361854A1 HOUSINGS FOR ELECTRONIC DEVICES Public/Granted day:2016-12-15
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