Abstract:
Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.
Abstract:
Methods for improved ceramics component casting. One such method may include vacuuming a ceramic-based slurry mixture and/or vacuuming a component mold. The vacuuming of the ceramic-based slurry mixture and the component mold may be to remove air bubbles from the respective elements. More specifically, the vacuuming may remove air bubbles from the ceramic-based slurry mixture and from a cavity of the component mold, respectively. The method may also include disposing the ceramic-based slurry mixture into the cavity of the component mold, and continuously vacuuming the cavity of the component mold including the ceramic-based slurry mixture for a predetermined time to remove any additional air bubbles included in the ceramic-based slurry mixture. Finally, the method may include forming a ceramic component within the continuously vacuumed cavity of the component mold over the duration of the predetermined time. The ceramic component formed from the ceramic-based slurry mixture.
Abstract:
Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.
Abstract:
Electronic devices and methods for creating various haptic effects. In one example, an electronic device may include a first haptic module for creating a first haptic effect, the first haptic module having a first weight member that selectively moves in a substantially vertical orientation relative to the first haptic module; a second haptic module for creating a second haptic effect, the second haptic module having a second weight member that selectively moves in a substantially horizontal orientation relative to the second haptic module; and a processor for controlling the first and second haptic modules. In one example, the processor selectively activates either the first haptic module or the second haptic module based on one or more events or conditions, such as the current orientation or position of the electronic device.
Abstract:
Electronic devices and methods for creating various haptic effects. In one example, an electronic device may include a first haptic module for creating a first haptic effect, the first haptic module having a first weight member that selectively moves in a substantially vertical orientation relative to the first haptic module; a second haptic module for creating a second haptic effect, the second haptic module having a second weight member that selectively moves in a substantially horizontal orientation relative to the second haptic module; and a processor for controlling the first and second haptic modules. In one example, the processor selectively activates either the first haptic module or the second haptic module based on one or more events or conditions, such as the current orientation or position of the electronic device.
Abstract:
Improved techniques for interacting with one or more handheld carriers hosting media content are disclosed. The handheld carrier hosting media content may be sensed, and at least a portion of the media content may be integrated into operation of a media activity provided by a computing device, upon recognizing the media activity and the media content. The media activity provided by the computing device may involve creating or editing an electronic document. The integration of the media content into operation of the media activity may involve insertion or importation of the media content into the electronic document.
Abstract:
Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.
Abstract:
Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.
Abstract:
Improved techniques for interacting with one or more handheld carriers hosting media content are disclosed. The handheld carrier hosting media content may be sensed, and at least a portion of the media content may be integrated into operation of a media activity provided by a computing device, upon recognizing the media activity and the media content. The media activity provided by the computing device may involve creating or editing an electronic document. The integration of the media content into operation of the media activity may involve insertion or importation of the media content into the electronic document.
Abstract:
Electronic devices and other apparatuses adapted to receive electromagnetic wave communications are disclosed. An outer housing encloses various device components, including at least an internal antenna located fully therewithin and adapted to receive/send communications from/to an outside source via RF or other electromagnetic waves. A ceramic coating can be a thermal spray coating that covers at least a portion of the outer surface proximate to the internal antenna, and can be “RF transparent”—adapted to allow communications to/from the internal antenna via electromagnetic waves. The outer housing can be plastic, metal or a combination thereof. For metal or other non-RF transparent housings, an RF-transparent insert can be fitted into a window in the housing to permit communications to the internal antenna. The ceramic coating covers some or all of the metal, plastic and/or insert that comprise the outer housing and surface for a final aesthetic finish to the device.