Invention Grant
- Patent Title: Position calibration method, test circuit board, sample panel and position calibration apparatus
-
Application No.: US15159181Application Date: 2016-05-19
-
Publication No.: US10247772B2Publication Date: 2019-04-02
- Inventor: Lei Hu , Hui Zhao , Wenjing Tan
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg; Daniel Bissing
- Priority: CN201510515942 20150820
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R31/00 ; G01R31/02 ; G01R31/28

Abstract:
The present invention discloses a position calibration method, a test circuit board, a sample panel and a position calibration apparatus. The position calibration method comprises: Step S1, providing a test circuit board and forming at least one first sample connecting finger; Step S2, making a sample panel comprising second sample connecting fingers corresponding to each first sample connecting finger; Step S3, bringing the test circuit board into contact with the sample panel; and Step S4, detecting whether each first sample connecting finger is electrically connected to a corresponding second sample connecting finger, and when any one of the first sample connecting fingers is detected as in disconnection with the corresponding second sample connecting finger, adjusting a position of the test circuit board and/or the sample panel.
Public/Granted literature
- US20170052214A1 Position Calibration Method, Test Circuit Board, Sample Panel and Position Calibration Apparatus Public/Granted day:2017-02-23
Information query