Invention Grant
- Patent Title: Low resistance source drain contact formation with trench metastable alloys and laser annealing
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Application No.: US15004751Application Date: 2016-01-22
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Publication No.: US10249502B2Publication Date: 2019-04-02
- Inventor: Oleg Gluschenkov , Zuoguang Liu , Shogo Mochizuki , Hiroaki Niimi , Tenko Yamashita , Chun-chen Yeh
- Applicant: International Business Machines Corporation , GLOBALFOUNDRIES Inc.
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Michael J. Chang, LLC
- Agent Vazken Alexanian
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/285 ; H01L29/08 ; H01L29/24 ; H01L29/267 ; H01L29/78 ; H01L29/66 ; H01L21/768

Abstract:
Techniques for forming a metastable phosphorous P-doped silicon Si source drain contacts are provided. In one aspect, a method for forming n-type source and drain contacts includes the steps of: forming a transistor on a substrate; depositing a dielectric over the transistor; forming contact trenches in the dielectric that extend down to source and drain regions of the transistor; forming an epitaxial material in the contact trenches on the source and drain regions; implanting P into the epitaxial material to form an amorphous P-doped layer; and annealing the amorphous P-doped layer under conditions sufficient to form a crystalline P-doped layer having a homogenous phosphorous concentration that is greater than about 1.5×1021 atoms per cubic centimeter (at./cm3). Transistor devices are also provided utilizing the present P-doped Si source and drain contacts.
Public/Granted literature
- US20170213739A1 Low Resistance Source Drain Contact Formation with Trench Metastable Alloys and Laser Annealing Public/Granted day:2017-07-27
Information query
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