Invention Grant
- Patent Title: Light emitting diode and method of manufacturing thereof
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Application No.: US15031766Application Date: 2015-12-10
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Publication No.: US10249796B2Publication Date: 2019-04-02
- Inventor: Jianjie Wu , Lili Chen , Ruijun Dong , Chenru Wang , Guangquan Wang , Haiwei Sun
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BOE (Hebei) Mobile Display Technology Co., Ltd.
- Applicant Address: CN Beijing CN Gu'An, Hebei
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BOE (Hebei) Mobile Display Technology Co., Ltd.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BOE (Hebei) Mobile Display Technology Co., Ltd.
- Current Assignee Address: CN Beijing CN Gu'An, Hebei
- Agency: Intellectual Valley Law, P.C.
- Priority: CN201510303480 20150604
- International Application: PCT/CN2015/096942 WO 20151210
- International Announcement: WO2016/192363 WO 20161208
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L33/38 ; H01L33/20 ; H01L33/46 ; H01L33/00 ; H01L33/06 ; H01L33/40

Abstract:
The present application discloses a light emitting diode comprising a substrate; and a light emitting layer on the substrate. The light emitting layer comprises, an N-type doped layer; a quantum well active layer; and a P-type doped layer. At least one of the N-type doped layer and the P-type doped layer comprises an uneven layer adapted to concentrate light emitting from the light emitting layer.
Public/Granted literature
- US20180145221A1 LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THEREOF Public/Granted day:2018-05-24
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