Invention Grant
- Patent Title: Circuit board and conductive pattern structure
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Application No.: US15198679Application Date: 2016-06-30
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Publication No.: US10251259B2Publication Date: 2019-04-02
- Inventor: Han Kim , Seong Hee Choi , Dae Hyun Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0140502 20151006
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H05K1/02

Abstract:
A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape.
Public/Granted literature
- US20170099729A1 CIRCUIT BOARD AND CONDUCTIVE PATTERN STRUCTURE Public/Granted day:2017-04-06
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