公开(公告)号：US11289264B2

公开(公告)日：2022-03-29

申请号：US16190993

申请日：2018-11-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Jun Lim ,  Yeong Min Jeong ,  Kyung Ho Lee ,  Han Kim ,  Sang Jong Lee ,  Su Bong Jang

IPC: H01F17/00 ,  H01F27/28 ,  H01F27/30

Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed on an external surface of the body, wherein the plurality of coil patterns are connected through coil connecting portions and include coil patterns disposed on an outer side and coil patterns disposed on an inner side thereof, a coil pattern disposed on the inner side adjacent to the coil pattern disposed on the outer side includes two coil connecting portions spaced apart from each other and facing each other in a length direction of the body, and a dummy electrode pattern is further disposed in a void portion between two coil connecting portions.

公开(公告)号：US10685926B2

公开(公告)日：2020-06-16

申请号：US16284289

申请日：2019-02-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun Lim ,  Han Kim ,  Chul Kyu Kim ,  Sang Jong Lee ,  Jung Ho Shim

IPC: H01L23/66 ,  H01Q1/24 ,  H01L23/00

Abstract: An antenna module includes an antenna substrate including a core layer, insulating layers disposed on opposite surfaces of the core layer, and wiring layers including antenna patterns. The antenna substrate has first and second recess portions. The antenna module further includes a passive component disposed in the first recess portion, a semiconductor chip disposed in the second recess portion and having an active surface, an encapsulant encapsulating at least portions of the semiconductor chip and the passive component, and a connection portion disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the semiconductor chip. The passive component has a thickness greater than that of the semiconductor chip, and the first recess portion has a depth greater than that of the second recess portion.

公开(公告)号：US10553541B2

公开(公告)日：2020-02-04

申请号：US15955230

申请日：2018-04-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Joon Kim ,  Jung Ho Shim ,  Dae Hyun Park ,  Han Kim

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00

Abstract: The present disclosure relates to a fan-out semiconductor package in which a plurality of semiconductor chips are stacked and packaged, and are disposed in a special form to be thus electrically connected to a redistribution layer of a connection member through vias rather than wires. The fan-out semiconductor package can further include a connection member having a through-hole, and at least one of the semiconductor chips can be disposed in the through-hole.

公开(公告)号：US10325891B1

公开(公告)日：2019-06-18

申请号：US15962577

申请日：2018-04-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun Lim ,  Han Kim ,  Eun Jung Jo ,  Jung Ho Shim ,  Sang Jong Lee ,  Hyung Joon Kim

IPC: H01L23/49 ,  H01L23/04 ,  H01L23/62 ,  H01L23/538 ,  H01L25/10 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L25/0657 ,  H01L2224/18 ,  H01L2225/1058

Abstract: The fan-out semiconductor package includes: a metal member including a metal plate having a first through-hole and second through-holes and metal posts disposed in the second through-holes; a semiconductor chip disposed in the first through-hole; an encapsulant covering at least portion of each of the metal member and the semiconductor chip and filling at least portions of each of the first and second through-holes; a wiring layer disposed on the encapsulant; first vias electrically connecting the wiring layer and the connection pads to each other; and second vias electrically connecting the wiring layer and the metal posts to each other, wherein a height of the second vias is greater than that of the first vias or a thickness of the metal plate is the same as that of the metal post.

公开(公告)号：US10256200B2

公开(公告)日：2019-04-09

申请号：US15877021

申请日：2018-01-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Hyun Park ,  Han Kim ,  Kang Heon Hur ,  Young Gwan Ko ,  Jung Ho Shim

IPC: H05K7/00 ,  H01L23/00 ,  H01L23/48 ,  H05K1/02 ,  H05K1/18 ,  H01L21/56

Abstract: An electronic component package and a method of manufacturing the same are provided. The electronic component package includes a frame having a through-hole, an electronic component disposed in the through-hole of the frame, and a redistribution part disposed at one side of the frame and the electronic component. One or more first wiring layers of the frame are electrically connected to the electronic component through the redistribution part.

公开(公告)号：US10217631B2

公开(公告)日：2019-02-26

申请号：US15673149

申请日：2017-08-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han Kim ,  Mi Ja Han ,  Dae Hyun Park ,  Sang Jong Lee ,  Seong Hee Choi

IPC: H01L21/02 ,  H01L21/48 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L23/552

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads. The first connection member includes a first electromagnetic interference (EMI) blocking part surrounding side surfaces of the semiconductor chip, the second connection member includes a second EMI blocking part surrounding the redistribution layer, and the first EMI blocking part and the second EMI blocking part are connected to each other.

公开(公告)号：US10096552B2

公开(公告)日：2018-10-09

申请号：US15689861

申请日：2017-08-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han Kim ,  Eun Jung Jo ,  Jung Ho Shim

IPC: H01L25/10 ,  H01L25/065 ,  H01L23/28 ,  H01L23/48 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48

Abstract: A fan-out semiconductor package includes: a first semiconductor chip; a first encapsulant; a connection member including first vias and a first redistribution layer; a second semiconductor chip; a second encapsulant; a second redistribution layer; second vias; and third vias. A length of the longest side of a first cut surface of the second via is less than that of the longest side of a second cut surface of the third via, the first cut surface of the second via and the second cut surface of the third via being cut by a plane on any level parallel to the second active surface.

公开(公告)号：US10026703B2

公开(公告)日：2018-07-17

申请号：US15679860

申请日：2017-08-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yun Tae Lee ,  Sung Han Kim ,  Han Kim

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface disposed to oppose the active surface; a dummy chip disposed in the through-hole and spaced apart from the semiconductor chip; a second connection member disposed on the first connection member, the dummy chip, and the active surface of the semiconductor chip; and an encapsulant encapsulating at least portions of the first connection member, the dummy chip, and the inactive surface of the semiconductor chip. The first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads.

公开(公告)号：US09991744B2

公开(公告)日：2018-06-05

申请号：US15196426

申请日：2016-06-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Jong Lee ,  Han Kim ,  Tae Ho Yun ,  Kang Heon Hur ,  Su Bong Jang

IPC: H02J7/00 ,  H02J50/10 ,  H02J50/80 ,  H02J7/02 ,  H04B5/00 ,  H02J50/90

CPC classification number: H02J50/10 ,  H01F27/006 ,  H01F38/14 ,  H01F2038/143 ,  H02J7/025 ,  H02J50/80 ,  H02J50/90 ,  H04B5/0037

Abstract: A wireless power receiving device includes a first coil partially disposed in an outer region and configured to transmit and/or receive data; and a second coil disposed inwardly of an inner boundary line of the outer region and configured to receive wirelessly transmitted power, wherein a center defined by an inner boundary line and a center defined by an outer boundary line of the second coil are different from each other.

公开(公告)号：US09984979B2

公开(公告)日：2018-05-29

申请号：US15297831

申请日：2016-10-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Hyun Park ,  Han Kim ,  Kang Heon Hur ,  Young Gwan Ko ,  Jung Ho Shim

IPC: H05K7/00 ,  H01L23/538 ,  H01L25/10 ,  H01L21/48 ,  H01L25/00 ,  H01L21/683 ,  H01L23/48 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H01L21/56

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/00 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2221/68386 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/16238 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present disclosure relates to a fan-out semiconductor package and a method of manufacturing the same. The fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member includes a first insulating layer, a first redistribution layer and a second redistribution layer disposed on one surface and the other surface of the first insulating layer opposing the one surface thereof, respectively, a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, and a third redistribution layer disposed on the second insulating layer. A fan-out semiconductor package may include one or more connection units instead of the first connection member.