The invention relates to electronic equipment including the following steps: a box including a thermally-conductive chassis; a thermally-conductive stand in contact with the chassis and including a plastics covering that covers it at least in part; and electronic components inside the box including a hottest electronic component that is the greatest source of heat inside the box and/or that presents the highest temperature from among the electronic components, the hottest electronic component being arranged in contact with the thermally-conductive chassis.