Invention Grant
- Patent Title: Wire harness assembly system
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Application No.: US14884240Application Date: 2015-10-15
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Publication No.: US10256011B2Publication Date: 2019-04-09
- Inventor: Rodney G. Rouleau , Janina B. Nebes , Robert W. Kossak
- Applicant: Panduit Corp.
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Christopher S. Clancy; James H. Williams; Aimee E. McVady
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H01R43/00 ; H01B13/012 ; H01R43/20 ; H05K13/06

Abstract:
A wire harness assembly system is disclosed. The wire harness assembly system includes a grid tile designed to receive repositionable accessories to route wires along the grid tile. The grid tile includes a plurality of keyed holes extending from the top of the grid tile, through the grid tile, to the bottom of the grid tile. The grid tile also includes a locking surface on the bottom of the grid tile. The locking surface complements the plurality of keyed holes to receive the repositionable accessory and to maintain the repositionable accessory in a locked position.
Public/Granted literature
- US20160126687A1 Wire Harness Assembly System Public/Granted day:2016-05-05
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