- Patent Title: Electronic component package and method of manufacturing the same
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Application No.: US15877021Application Date: 2018-01-22
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Publication No.: US10256200B2Publication Date: 2019-04-09
- Inventor: Dae Hyun Park , Han Kim , Kang Heon Hur , Young Gwan Ko , Jung Ho Shim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR10-2015-0065177 20150511; KR10-2015-0139682 20151005; KR10-2016-0047455 20160419
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01L23/00 ; H01L23/48 ; H05K1/02 ; H05K1/18 ; H01L21/56
Abstract:
An electronic component package and a method of manufacturing the same are provided. The electronic component package includes a frame having a through-hole, an electronic component disposed in the through-hole of the frame, and a redistribution part disposed at one side of the frame and the electronic component. One or more first wiring layers of the frame are electrically connected to the electronic component through the redistribution part.
Public/Granted literature
- US20180145044A1 ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-05-24
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