Invention Grant
- Patent Title: High-voltage semiconductor device and method for manufacturing the same
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Application No.: US15140780Application Date: 2016-04-28
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Publication No.: US10256340B2Publication Date: 2019-04-09
- Inventor: Yu-Lung Chin , Shin-Cheng Lin , Wen-Hsin Lin , Cheng-Tsung Wu
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- Current Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/94
- IPC: H01L29/94 ; H01L29/78 ; H01L29/66 ; H01L29/423 ; H01L21/761 ; H01L29/06 ; H01L29/10

Abstract:
A high-voltage semiconductor device is provided. The device includes a semiconductor substrate having a first conductivity type, and a first doping region having a second conductivity type therein. An epitaxial layer is on the semiconductor substrate. A body region having the first conductivity type is in the epitaxial layer on the first doping region. A second doping region and a third doping region that have the second conductivity type are respectively in the epitaxial layer on both opposite sides of the body region, so as to adjoin the body region. Source and drain regions are respectively in the body region and the second doping region. A field insulating layer is in the second doping region between the source and drain regions. A gate structure is on the epitaxial layer to cover a portion of the field insulating layer.
Public/Granted literature
- US20170317208A1 HIGH-VOLTAGE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-11-02
Information query
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