Invention Grant
- Patent Title: Vertical combiner for overlapped linear phased array
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Application No.: US15077246Application Date: 2016-03-22
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Publication No.: US10256522B2Publication Date: 2019-04-09
- Inventor: Wenyao Zhai , Vahid Miraftab
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Main IPC: H01P5/18
- IPC: H01P5/18 ; H01Q21/00 ; H01P5/12 ; H01Q21/06 ; H01P5/02

Abstract:
A vertical combiner for an overlapping linear phased array is provided. The vertical vector combiner enables two strip-line signals from different layers to be combined, or divided, by vertical transitions between substrate layers and produce a desired output signal phase. The combiner can terminate in a short to act as an antenna. In an antenna application, the antenna provides multiple substrate layers for each strip-line signal, each having a metal ground plane. The ground planes are be coupled by vertical transitions access enabling a stepped ground within the structure which increases bandwidth. The multi-layer combiner architecture enables integration with phased array feed networks for millimeter wave phased array antennas.
Public/Granted literature
- US20170279178A1 Vertical Combiner for Overlapped Linear Phased Array Public/Granted day:2017-09-28
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