Invention Grant
- Patent Title: Low-inductance half-bridge arrangement
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Application No.: US15891083Application Date: 2018-02-07
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Publication No.: US10256718B2Publication Date: 2019-04-09
- Inventor: Johannes Fürst , Marvin Tannhäuser
- Applicant: Siemens Aktiengesellschaft
- Applicant Address: DE München
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE München
- Agency: Henry M. Feiereisen LLC
- Priority: EP17155207 20170208
- Main IPC: H02M1/42
- IPC: H02M1/42 ; H02M1/088 ; H05K1/02 ; H02M7/00 ; H02M7/483

Abstract:
The switching performance of a half-bridge arrangement particularly for a converter shall be improved. For this purpose, a half-bridge arrangement has a circuit board having at least four trace layers and two switching elements and a capacitor device arranged on opposite sides of the circuit board and interconnected so as to produce, during a commutation event of the half-bridge arrangement, at least two dipoles having opposite spatial directions.
Public/Granted literature
- US20180226886A1 LOW-INDUCTANCE HALF-BRIDGE ARRANGEMENT Public/Granted day:2018-08-09
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