Invention Grant
- Patent Title: Apparatus and method for processing header compressed packet in electronic device
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Application No.: US14553267Application Date: 2014-11-25
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Publication No.: US10257323B2Publication Date: 2019-04-09
- Inventor: Kamma Ganesh Babu , Praveen Chebolu , Jai-Dong Kim , Hyeun-Mok Jung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: IN1331/KOL/2013 20131125; KR10-2014-0000763 20140103
- Main IPC: H04J3/18
- IPC: H04J3/18 ; H04L12/26 ; H04L29/06 ; H04M7/00
Abstract:
An electronic device process data including a compressed header is provided. The electronic device includes a controller configured to generate a data packet comprising a header compressed based on at least one data packet previously transmitted, and a transmitter configured to transmit the data packet.
Public/Granted literature
- US20150146729A1 APPARATUS AND METHOD FOR PROCESSING HEADER COMPRESSED PACKET IN ELECTRONIC DEVICE Public/Granted day:2015-05-28
Information query
