- 专利标题： Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules
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申请号： US14994755申请日： 2016-01-13
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公开(公告)号： US10257426B2公开(公告)日： 2019-04-09
- 发明人: Yun Tae Lee , Joon Seo Yim , Je Suk Lee , Jae Yong Park , Jun-Woo Park , Su-Young Lee
- 申请人： Yun Tae Lee , Joon Seo Yim , Je Suk Lee , Jae Yong Park , Jun-Woo Park , Su-Young Lee
- 申请人地址： KR Gyeonggi-Do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Gyeonggi-Do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR10-2009-0125412 20091216; KR10-2010-0000266 20100104; KR10-2010-0052290 20100603
- 主分类号： H04N5/232
- IPC分类号： H04N5/232 ; H01L27/146 ; H04N5/225 ; H04N5/345 ; H04N9/04 ; H04N5/374 ; H04N5/378 ; H04N5/369
摘要：
An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
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