Invention Grant
- Patent Title: High-frequency module
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Application No.: US15631473Application Date: 2017-06-23
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Publication No.: US10262875B2Publication Date: 2019-04-16
- Inventor: Takeshi Kogure , Atsushi Ono , Hiroyuki Nagamori
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2014-261517 20141225
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H04B1/00 ; H04B1/50 ; H01L23/31 ; H01L23/538 ; H05K1/02

Abstract:
On a substrate (200), a resistor (24R) is disposed between a position of an amplifier circuit (11) and a position of a duplexer (24), thereby reducing coupling occurring in a space between the amplifier circuit (11) and a path extending from a main switch (26) to a reception terminal (P24) through the duplexer (24). Even when an RX terminal (242) of the duplexer (24) is oriented toward an amplifier circuit (11) side, a high-frequency module (100) reduces the coupling and can thus prevent a harmonic of a transmission signal in a low band from leaking to the reception terminal (P24) through a path formed by the coupling. That is, the high-frequency module (100) can prevent a reduction in isolation characteristics in the low band and a high band and also provide flexibility in substrate layout.
Public/Granted literature
- US20170301561A1 HIGH-FREQUENCY MODULE Public/Granted day:2017-10-19
Information query
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