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公开(公告)号：US09917615B2
公开(公告)日：2018-03-13
申请号：US15607734
申请日：2017-05-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Atsushi Ono , Hiroyuki Nagamori
CPC classification number: H04B1/525 , G01S1/20 , H03F1/02 , H03F3/24 , H03J7/186 , H04B1/0057 , H04B1/04 , H04B1/123 , H04B1/44 , H04B2001/045
Abstract: A radio-frequency module includes a first transmitter-and-receiver that transmits and receives a signal in a first band, and a second transmitter-and-receiver that transmits and receives a signal in a second band higher than the first band. The first transmitter-and-receiver includes a first amplifier circuit and a first separator circuit and the second transmitter-and-receiver includes a second amplifier circuit and a second separator circuit. The first separator is located on a substrate between the first amplifier circuit and the second separator circuit, such that the first separator circuit is spatially interposed between the first amplifier circuit and the second separator circuit.
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公开(公告)号：US12126308B2
公开(公告)日：2024-10-22
申请号：US18055957
申请日：2022-11-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Tomohide Aramata
Abstract: A tracker module is provided that includes a second substrate that is separate from a first substrate, a tracker component, and a low pass filter. A power amplifier is disposed on or in the first substrate. Moreover, the tracker component supplies a power supply voltage to the power amplifier. The low pass filter is disposed on a path between an output terminal of the tracker component and the power amplifier. The tracker component and the low pass filter are disposed on or in the second substrate.
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公开(公告)号：US11283584B2
公开(公告)日：2022-03-22
申请号：US16433286
申请日：2019-06-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Syunji Yoshimi , Takeshi Kogure
Abstract: A high frequency module includes a duplexer that includes a transmission filter, a receive-only filter, and a power amplifier that power-amplifies a transmission signal. In order to improve the isolation characteristics between a transmission signal and a reception signal at the duplexer, the receive-only filter is arranged between the power amplifier and the duplexer.
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公开(公告)号：US10524353B2
公开(公告)日：2019-12-31
申请号：US15966227
申请日：2018-04-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure
Abstract: To enhance the isolation between signal lines for transmitting high-frequency signals included in a circuit board. A circuit board includes a plurality of signal lines for transmitting high-frequency signals, a ground electrode positioned between the plurality of signal lines and spaced apart from each of the plurality of signal lines, and a plurality of via conductors connected to the ground electrode. When the circuit board is seen in plan view, the ground electrode has a protruded and recessed area in at least a section of an outer edge thereof, the protruded and recessed area outwardly protruded and inwardly recessed. The plurality of via conductors is positioned in the protruded and recessed area so as to match with a protruded and recessed shape of the protruded and recessed area.
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公开(公告)号：US10142087B2
公开(公告)日：2018-11-27
申请号：US15710023
申请日：2017-09-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure
Abstract: Provided is a transmission/reception module that includes: a power amplifier that outputs a transmission signal to an input/output terminal; a low-noise amplifier that amplifies a reception signal input from the input/output terminal; a duplexer that isolates the transmission signal, which is output to the input/output terminal from the power amplifier via a transmission node and a common node, and the reception signal, which is input to the low-noise amplifier from the input/output terminal via the common node and a reception node, from each other; and a phase-shift circuit that is provided between an input node of the low-noise amplifier and the reception node of the duplexer, and that adjusts an impedance at the input node of the low-noise amplifier with respect to the transmission signal and the reception signal such that the gain of the transmission signal is smaller than the gain of the reception signal.
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Patent Agency Ranking
公开(公告)号：US20180183483A1
公开(公告)日：2018-06-28
申请号：US15850211
申请日：2017-12-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Yuji Takematsu , Katsunari Nakazawa
CPC classification number: H04B1/40 , H03F1/56 , H03F3/195 , H03F3/213 , H03F3/245 , H03F2200/111 , H03F2200/378 , H03F2200/387 , H03F2200/451 , H03H7/38 , H04B1/006
Abstract: A communication module includes a power amplifier that amplifies a transmission signal having a first communication system or a second communication system and outputs an amplified signal to a signal path, a switch circuit that switches between a signal path for the first communication system and a signal path for the second communication system and outputs the amplified signal to one of the signal paths for the first communication system and the second communication system in accordance with a control signal supplied in accordance with the communication system of the transmission signal, and an impedance-matching network disposed between the power amplifier and the switch circuit, the impedance-matching network including a first variable capacitance element. The first variable capacitance element has a capacitance value that is controlled in accordance with the communication system of the transmission signal.
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公开(公告)号：US20170208677A1
公开(公告)日：2017-07-20
申请号：US15474146
申请日：2017-03-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Atsushi Ono , Hiroyuki Nagamori , Takanori Uejima
IPC: H05K1/02 , H05K1/11 , H05K1/18 , H05K3/40 , H01L23/367 , H01L21/48 , H05K3/46 , H05K1/03 , H01L23/498
CPC classification number: H05K1/0206 , H01L21/4857 , H01L21/486 , H01L23/15 , H01L23/367 , H01L23/3735 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L2924/0002 , H05K1/0306 , H05K1/113 , H05K1/181 , H05K3/4038 , H05K3/4629 , H05K3/4644 , H05K2201/096 , H05K2201/0979 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10734 , H01L2924/00
Abstract: A multilayer substrate includes a component mounting electrode, an external mounting electrode, and a heat dissipating unit. The component mounting electrode is connected to an electronic component that is connected to an external structure. The heat dissipating unit is constituted by a plurality of via-conductors partially superposed each other in a stacking direction of the multilayer substrate and disposed continuously between the component mounting electrode and the external mounting electrode. The heat dissipating unit includes communicating portions, each in which one via-conductor is disposed per ceramic layer, and a branching portion in which a plurality of via-conductors are disposed continuously between the communicating portions per ceramic layer. Where the via-conductors of the branching portion and the via-conductor of the communicating portion are adjacent to each other, the positions of the centers of the adjacent via-conductors are separated from each other as viewed from the stacking direction.
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公开(公告)号：US11349521B2
公开(公告)日：2022-05-31
申请号：US17235309
申请日：2021-04-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenji Tahara , Seikoh Ono , Kunihiro Watanabe , Hiroshi Masuda , Naohide Tomita , Takeshi Kogure , Yusuke Tanaka
IPC: H04B1/44
Abstract: A radio-frequency signal transmitting and receiving circuit includes a power amplifier, a transmission band pass filter configured to transmit a radio-frequency input signal, a first reception band pass filter configured to transmit a first radio-frequency reception signal, a first low-noise amplifier configured to amplify the first radio-frequency reception signal and output a first radio-frequency output signal, a first transmitting and receiving filter having a first end and a second end, the first end being electrically connected to a first antenna terminal, and a switch configured to electrically connect the transmission band pass filter to the second end of the first transmitting and receiving filter to output the radio-frequency input signal to the first antenna terminal and electrically connect the second end of the first transmitting and receiving filter to the first reception band pass filter to receive the first radio-frequency reception signal from the first antenna terminal.
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公开(公告)号：US20190288826A1
公开(公告)日：2019-09-19
申请号：US16433286
申请日：2019-06-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Syunji YOSHIMI , Takeshi Kogure
Abstract: A high frequency module includes a duplexer that includes a transmission filter, a receive-only filter, and a power amplifier that power-amplifies a transmission signal. In order to improve the isolation characteristics between a transmission signal and a reception signal at the duplexer, the receive-only filter is arranged between the power amplifier and the duplexer.
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公开(公告)号：US10262875B2
公开(公告)日：2019-04-16
申请号：US15631473
申请日：2017-06-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Atsushi Ono , Hiroyuki Nagamori
Abstract: On a substrate (200), a resistor (24R) is disposed between a position of an amplifier circuit (11) and a position of a duplexer (24), thereby reducing coupling occurring in a space between the amplifier circuit (11) and a path extending from a main switch (26) to a reception terminal (P24) through the duplexer (24). Even when an RX terminal (242) of the duplexer (24) is oriented toward an amplifier circuit (11) side, a high-frequency module (100) reduces the coupling and can thus prevent a harmonic of a transmission signal in a low band from leaking to the reception terminal (P24) through a path formed by the coupling. That is, the high-frequency module (100) can prevent a reduction in isolation characteristics in the low band and a high band and also provide flexibility in substrate layout.
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