Invention Grant
- Patent Title: LD module cooling device and laser apparatus
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Application No.: US16003483Application Date: 2018-06-08
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Publication No.: US10263388B2Publication Date: 2019-04-16
- Inventor: Hiroshi Takigawa , Hiroyuki Yoshida
- Applicant: FANUC CORPORATION
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Studebaker & Brackett PC
- Priority: JP2017-135199 20170711
- Main IPC: H01S3/04
- IPC: H01S3/04 ; H01S5/024 ; H01S5/06 ; H01S5/40 ; H01S5/42

Abstract:
An LD module cooling device includes, in a cooling plate, common flow paths that supply/drain a cooling medium in parallel to/from a plurality of cooling portion flow paths that correspond to a plurality of LD modules, in which the cooling portion flow path is a thin layer flow path having a flow path height and a flow path width that are constant in at least a majority of a flow path length, a rectangular shape of the cooling portion flow path defined by the dimensions flow path length×flow path width overlaps with at least the majority of a main contact surface between the cooling plate and the LD modules as viewed from a front surface of the cooling plate, the flow path height of the cooling portion flow path satisfies at least either one of a condition that flow path height is 1/20 or less of the flow path length and the flow path width, and a condition that the flow path height is 0.5 mm or less, and pressure loss of a cooling medium in the cooling portion flow path is greater than pressure loss of a cooling medium in the common flow paths.
Public/Granted literature
- US20190020175A1 LD MODULE COOLING DEVICE AND LASER APPARATUS Public/Granted day:2019-01-17
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