Invention Grant
- Patent Title: Alignment mark design for packages
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Application No.: US15631555Application Date: 2017-06-23
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Publication No.: US10269723B2Publication Date: 2019-04-23
- Inventor: Li-Hsien Huang , Hsien-Wei Chen , Ching-Wen Hsiao , Der-Chyang Yeh , Shin-Puu Jeng , Chen-Hua Yu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L23/00 ; H01L23/31 ; H01L25/00 ; H01L25/10 ; H01L21/683 ; H01L21/768 ; H01L23/498 ; H01L23/522 ; H01L23/538 ; H01L23/544 ; H01L25/065
Abstract:
A package includes a device die, a molding material molding the device die therein, a through-via penetrating through the molding material, and an alignment mark penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via.
Public/Granted literature
- US20170287845A1 Alignment Mark Design for Packages Public/Granted day:2017-10-05
Information query
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