Invention Grant
- Patent Title: Sensor, manufacturing method thereof and electronic device
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Application No.: US15540411Application Date: 2016-09-21
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Publication No.: US10269837B2Publication Date: 2019-04-23
- Inventor: Chia Chiang Lin
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , KA IMAGING INC.
- Applicant Address: CN Beijing CA Kitchener, ON
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,KA IMAGING INC.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,KA IMAGING INC.
- Current Assignee Address: CN Beijing CA Kitchener, ON
- Agency: Ladas & Parry LLP
- Priority: CN201610236910 20160415
- International Application: PCT/CN2016/099579 WO 20160921
- International Announcement: WO2017/177618 WO 20171019
- Main IPC: G01L9/08
- IPC: G01L9/08 ; H01L31/02 ; H01L31/20 ; H01L27/144 ; H01L29/786 ; H01L31/0216 ; H01L31/0376

Abstract:
A sensor, a manufacturing method thereof and an electronic device. The sensor includes: a base substrate; a thin-film transistor (TFT) disposed on the base substrate and including a source electrode; a first insulation layer disposed on the TFT and provided with a first through hole running through the first insulation layer; a conductive layer disposed in the first through hole and on part of the first insulation layer and electrically connected with the source electrode via the first through hole; a bias electrode disposed on the first insulation layer and separate from the conductive layer; a sensing active layer respectively connected with the conductive layer and the bias electrode; and an auxiliary conductive layer disposed on the conductive layer. The sensor and the manufacturing method thereof improve the conductivity and ensure normal transmission of signals by arranging the auxiliary conductive layer on the conductive layer without addition of processes.
Public/Granted literature
- US20180122841A1 SENSOR, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE Public/Granted day:2018-05-03
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